- 1). Turn the soldering iron on and set it at a temperature of 400 degrees Fahrenheit.
- 2). Place the PCB on a flat and dry surface with the component side facing up.
- 3). Identify the pads on the PCB where the component is to be soldered. Melt the solder flux on any one of these pads. To do that, hold the solder wire on the pad and touch the interface of the wire and the pad with the tip of the soldering iron. The solder flux will melt and fill the pad within two to three seconds. As soon as you notice that the flux has fully covered the pad, retract the solder wire and place the soldering iron tip back in its holder.
- 4). Place the IC on the PCB; use tweezers so the IC terminals are aligned with the pads on the board. Note that the IC will be slightly tilted due to the solder on one of the pads. Touch the soldered pad with the soldering iron tip. The solder will melt and the IC's terminal will sink to the bottom. Put the soldering iron tip back in its holder and let the solder flux cool down and solidify for about five seconds.
- 5). Hold the solder wire on the next PCB pad at an angle that allows its tip to touch both the pad and the IC's terminal. Touch the tip of the soldering iron to the interface of the wire, the pad and the terminal until the solder flux melts and fills the pad. Retract the solder wire and place the soldering iron tip back in its holder. Repeat this process to solder the remaining terminals of the IC.
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